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Peel & Stick
Semiconductors
Forged Heat Sinks
Standard ZIF
ZIF III
Machined ZIF
Heat Frames
Plastic Case
Low Cost 7-Series
Metal Case

Plastic Case, Case-Mounted Semiconductors


Heat Sink Configuration
Part Number Series
Natural Conv. (șC/W)
Forced Air (șC/W)
Mounting Envelope LxWxH (Inches)
Data Sheet (.PDF)
Free-Standing Clip-On
 PA2-7 32.6 10
N/A
 
 PA1-7 29.2 9.2
N/A
Vertical Board-Mounted
 PSB2 25.4 6.8
N/A
PB1-36 20 5.7
N/A
PSE1 15 4.2
N/A
Horizontal Board-Mounted
 PA2 30 10.2 .71 x 1.00 x .31
  PC1 27.3 9.6 .75 x .75 x .38
  PA1 26.8 8.6 .71 x 1.00 x .50
  PB1 22.1 6.9 1.18 x 1.00 x .50
  LA -- A1 25 8 1.31 x .90 x .25
  LA -- A2 20 6.2 1.31 x .90 x .50
  LA -- A3 17 5 1.31 x .90 x .75
  LA -- A4 14.7 4.2 1.31 x .90 x 1.00
  LA -- B7 16.3 5.3 1.63 x 1.29 x .40
  LA -- B2 15 5 1.63 x 1.29 x .50
  LA -- B3 12.9 4.2 1.63 x 1.29 x .75
  LA -- B4 11.4 3.6 1.63 x 1.29 x 1.00
  LA -- B5 9.7 3.3 1.63 x 1.29 x 1.25
  UP3 15 4.4 1.50 x 1.38 x .44
  UP 8.2 2.9 1.78 x 1.78 x 1.00
  UP10 7.5 2.2 3.38 x 1.40 x .44
  HP1 6.5 2.5 2.50 x 2.50 x .90
  HP3 5 2.2 3.13 x 3.13 x 1.00


 

 

 

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